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Latest News
  2012/09/05-07 Participated in Semicon Taiwan 2012 to introduce the newly developed SiC/sapphire wafer polishing technologies.

Booth No.:1208
  2012/01/18-20 Participated in Nepcon Japan 2012 to introduce the newly developed SiC/sapphire wafer polishing technologies.
The exhibit will be in Semiconductor Packaging Technology Show (West Hall) and the seminar will be held at West No. 3 hall D during Jan.18th 13:40 -14:40.
  2011/11 The Rokko’s “Green Curtains” were introduced in the environmental report issued by Nishinomiya city.
  2011/08/11 The Rokko’s “Green Curtains”
  2011/07/30 Carried out the emergency evacuation drill
  2011/07/13-15 Participated in 22nd Micromachine/MEMS Show.
  2011/07/6-7 Participated in SIIQ Semiconductor festival.
Presentation schedule:
Dates  :July 6th (Wed) 13:00 ? 13:30
Location :SIIQ Semiconductor festival, 2nd Floor lecturing room
Theme:”MEMS wafer special grinding, polishing process & SiC, sapphire substrates
  2010/12/01 Participated in “Semicon Japan 2010” at Chiba Makuhari Mess for the first time.
2010/11/01 Announced its organizational changes.
2010/07/12 Rokko Denshi brochures are now available. Contact us through our website.
2010/04/30 Started Rokko Denshi Blogs
2010/04/23 Rokko Denshi websites are completed.
2010/04/21 “Company Aspect” pages are published in the Rokko’s websites. Pictures are also available.
2010/04/20 “Processing Technologies” are ready.
2010/04/14 “Business Info” and “About Us” pages are published.
2010/04/01 The top page of Rokko Denshi company website was modified.
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