Current trends in the sapphire and SiC wafer industries, the dimeter
of wafer becomes larger and larger. Because of this trends, Rokko
sees the limitations of the conventional process equipment. Therefore,
Rokko has introduced fixed-abrasive-grain type equipment to their
sapphire and SiC grinding services.
This newly introduced service is now available for customer evaluations.
■ Rokko's
philosophy of sapphire and SiC wafer process
●Rokko is capable of providing process services at the same control
level of the semiconductor industry that is cultivated through long
term relationships with our customers. (DIW, clean room control,
work standards for equipment control/operator education/operator
certification)
●A wax-less process is established for not only prime wafers but
also for wafers with devices. Because cleanness is very critical
in the wafer thinning business.
●The integrated process services are available. Thinning work →
Mirroring・Stress relief (Polishing) → Processed surface cleaning
(contamination・particle removals) (RCA cleaning) and Beveling
●In caparison with the conventional process methods, Rokko’s services
is proved to be better in process time and costs.
Conventional process
Rokko's process
Diamond lapping
Diamond lapping
Polishing, CMP
Grinding
Polishing, CMP
Running cost
High
(Metal wheels + Diamonds)
High
(Metal wheels + Diamonds)
Moderate
(Pads + Slurry)
Moderate
(Diamond wheels)
Moderate
(Pads + slurry)
Required level of process technology
High
High
Moderate
High
High
Cost of equipment
High
High
Moderate
High
High
Throughput
Very low
Very low
Low
Moderate
Moderate
Remarks
Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Vacuum chucking
system.
Automatic grinding machine for sapphire and .SiC
Waxless polishing
■ New equipment：
● Diamond lapping equipment
For 3,4,5,6 inch.
● Diamond lapping equipment
Film stripping for ＳｉＣ wafer reclaim.
Specialized Grinder for
Sapphire and SiC
Specialized Grinder for
Sapphire and SiC
This equipment is made for 6 inch hard-substrate wafers such
as sapphire and SiC.
Automated process via NC control system
Specialized Grinder for
Sapphire and SiC
Specialized Grinder for
Sapphire and SiC
This machine is equipped with an automated wafer conveyance
system to perform fully automated wafer processing.
Equipped with a vacuum checking system (Wax-less)
6 inch Sapphire wafer
6 inch Sapphire wafer
Both patterned and prime wafers can be processed.
SiC wafers are processed by the special grinding wheel.
6 inch SiC wafe
6 inch SiC wafe
Both patterned and prime wafers can be processed.
SiC wafers are processed by the special grinding wheel.
