rokko electronics co., ltd.


japanese

chinese

korean



home
site maptopicsprivacy policy
business info company aspect process technology quality enviroment
about rokko
access
inquery

Specialized Grinder for Sapphire and SiC


contact form
Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

contact form

Job Opportunities
Please click below



job opportunities



power device

sensor device

reclaim

mems

SiC

saffhire

assurance

quality

enviroment

safety

premium process

inspection equipment

sapphire & SiC specialized grinder

knife edge prevention process

back grinder

polish

for pattern wafer RCA cleaning


YOUTUBE

access

blog

ISO9001&ISO14001

経営革新計画

阪神南リーディングテクノロジー

中小企業庁承認BCP

西宮市元気産業育成補助金

西宮市地球温暖化防止

円高エネルギー制約対策補助金

ものづくり中小企業試作開発支援

事業高度化計画

中小企業海外進出調査支援事業

ものづくり商業サービス確信補助金



平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■  Specialized Grinder for Sapphire and SiC

Current trends in the sapphier and SiC wafer industries, the dimeter of wafer becomes larger and larger. Because of this trends, Rokko sees the limitations of the conventional process equipment. Therefore, Rokko has introduced fixed-abrasive-grain type equipment to their sapphire and SiC grinding services.This newly introduced service is now available for customer evaluations.
Rokko’s philosophy of sapphire and SiC wafer process
●Rokko is capable of providing process services at the same control level of the semiconductor industry that is cultivated through long term relationships with our customers. (DIW, clean room control, work standards for equipment control/operator education/operator certification)
●A wax-less process is established for not only prime wafers but also for wafers with devices. Because cleanness is very critical in the wafer thinning business.
●The integrated process services are available. Thinning work → Mirroring・Stress relief (Polishing) → Processed surface cleaning (contamination・particle removals) (RCA cleaning) and Beveling
●In caparison with the conventional process methods, Rokko’s services is proved to be better in process time and costs.

Processing method for Sapphier and SiC wafer.

 New equipment:
daiamondo rapping equipment

daiamondo rapping equipment
For 3,4,5,6 inch.
daiamondo rapping equipment

daiamondo rapping equipment
Film stripping for SiC wafer reclaim.
Specialized Grinder for Sapphire and SiC

  Specialized Grinder for Sapphire and SiC

Specialized Grinder for Sapphire and SiC
This equipment is made for 6 inch hard-substrate wafers such as sapphire and SiC.

Specialized Grinder for Sapphire and SiC
Automated process via NC control system

Specialized Grinder for Sapphire and SiC
  Specialized Grinder for Sapphire and SiC

Specialized Grinder for Sapphire and SiC
This machine is equipped with an automated wafer conveyance system to perform fully automated wafer processing.

Specialized Grinder for Sapphire and SiC
Equipped with a vacuum checking system (Wax-less)
6 inch Sapphire wafer
  6 inch Sapphire wafer

Specialized Grinder for Sapphire and SiC
Both patterned and prime wafers can be processed.

Specialized Grinder for Sapphire and SiC
SiC wafers are processed by the special grinding wheel.
6 inch SiC wafe
  6 inch SiC wafe

Specialized Grinder for Sapphire and SiC
Both patterned and prime wafers can be processed.

Specialized Grinder for Sapphire and SiC
SiC wafers are processed by the special grinding wheel.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
c2010, ROKKO, All Rights Reserved.