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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■  Power Devices


Unlike other types of semiconductor devices, power devices are unsed in high voltage applications. So, the deivices is made from a hight tenssion proof silicon with high thermostability. The high tension proof silicon is formed by growing an epitaxial layer over silicon substrate and the substrate is thinned to improve its heat radiation performance. Rokko plays an important role in the wafer thinning process though its backside grinding services. The company has well developed technologies and process recipes to guarantee original quality of customer products during and after grinding. For instance, Rokko is able to use a special grinding wheel that stimulates growth of a gettering layer on grinded surface.


In a power device, an electric current flows in vertical direction (top to bottom). Because of its characteristics, a power device has electric poles on its backside to have a stream of electric current on front. The backside poles are formed through a metal deposition. In the deposition, a metal layer must grow uniformly or the bonding surface will start to come off (Air penetration causes temperature deviation). Therefore, the process requires a mirror finish rather than a stress relief normal polished surface. To comply with this technical requirement, Rokko is capable of providing mirror polished products that precisely meet customer’s standards through well-developed mirroring technologies.

Rokko has its strength in providing an integrated processing service.

(Grinding → Polishing → RCA cleaning)
■ Tools and Equipment

Visual inspection   Fully automated grinding machine

1軸グラインダー
Wafers are inspected at receiving, after taping and polishing.

1軸グラインダー
Grinds wafers of 4 to 8” diameter precisely without influencing its flatness.
Single-wafer system polishing machine   Wafer mounting

1軸グラインダー
Wafers are polished according to customer’s thickness requirements.

1軸グラインダー
Wafers are mounted on a ceramic plate.
Batch system polishing machine   Wafer demounting

1軸グラインダー
Polishes 4 to 8” wafers for mirroring.

1軸グラインダー
Wafers are demounted from a plate after polishing.
RCA cleaning   Final inspection

1軸グラインダー
Wafers are cleaned to remove particles and metal contaminations after polishing.

1軸グラインダー
Wafers are measured and inspected to comply with customer’s specifications.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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