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事業案内


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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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back grinder

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for pattern wafer RCA cleaning


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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■ Services

Rokko takes the following roles in the semiconductor production process.

- Wafer surface and backside sophisticate grinding and polishing
- Monitor wafer reclaiming
- Chemical processing and RCA cleaning to control metal contaminations and particles in reclaim wafer process.
- Special wafer processing for MEMS applications

■ Main process services

主要加工内容図

■ Introduction and description of the used equipments in each process
UV irradiator
  Fully Automated Grinding machine

UV照射器
Capable of a single wafer and multiple wafer productions.

フルオートグラインダー
Capable of a single wafer and multiple wafer productions.
One-cylindered Grinding machine
  Dual steam cleaning tool


1軸グラインダー
Compatible with 12 inch diameter

2流体洗浄器
This single tool provides DIW cleaning, rinsing and air drying to wafers up to 8 inch diameter.

モニター再生加工
Film stripping   Batch system polishing machine

膜除去
Various films on wafers are removed by chemical etching.

バッチ式研磨機
Performs multiple wafer mirror-polishing.
Single wafer polishing machine
  RCA cleaning equipment

枚葉式研磨機
A single wafer type polisher

RCA洗浄装置
Wafers are cleaned to remove particles and metal contaminations.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
c2010, ROKKO, All Rights Reserved.