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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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for pattern wafer RCA cleaning


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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■ Inspection Equipment
Rokko is making continuous efforts to develop new technologies in not only Si wafer but also sapphire and SiC process through our cultivated experiences in grinding, polishing and cleaning fields. We believe customer satisfaction is the base of our technology development and our success cannt be achieved without the support from our customers. Based on this standard, we will make further efforts to ensure the satisfaction by introducing cutting edge equipment and technologies.

Automatic spectral interference wafer thickness meter

分Automatic spectral interference wafer thickness meter
Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).
Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

New equipment:Wafer sorter for resistivity・P/N・thickness
Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
For 4,5,6,8 inch
Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
Measurable resistivity:1.0m〜3.0MΩ・cm

Candela CS20 Wafer surface inspection machine

  Candela CS20 Wafer surface inspection machine

枚葉式研磨機
This is used for transparent substrates to inspect various defects, dirt, pits on Epi layers, hatching and crystal damages.

枚葉式研磨機
Wafer Size: 3, 4, 5, and 6 Inch
Measurable thickness: 300-1400um
Capacitance wafer thickness measuring equpment TME-07
  Capacitance wafer thickness measuring equpment TME-07

枚葉式研磨機
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.

枚葉式研磨機
Measurable thickness: 100-1800um (depends on wafer sizes)
Center point measurement (Coordinates can be set through the machine configuration)
Total reflection x-ray fluorescence analysis tool TREX610   Differential interference contrast microscope

枚葉式研磨機
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)

枚葉式研磨機
This tool allows to observe roughness on a wafer surface.
Wafer surface laser inspection tool TOPCON WM7   Wafer surface laser inspection tool TOPCON WM3

枚葉式研磨機
Detection limit: 7um
Unit: Long-life Violet LD laser type
Wafer Size: 4, 5 and 6 Inch
Ranges:0.087μ〜5.0μ

枚葉式研磨機
Wafer Size: 4, 5 and 6 Inch
Rages:0.208μ〜1.0μ
Wafer surface laser inspection tool LS6030   Visual inspection

枚葉式研磨機
Wafer Size: 5, 6, 8 Inch
Ranges:0.1μ〜5.0μ

1軸グラインダー
Wafers are inspected under a halogen lamp in a dark room.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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