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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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for pattern wafer RCA cleaning


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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■  Sensor Devices

In the sensor device process, frstly, electic circuits (patterns) are formed on wafer front surface. Secondly, backside of wafer is grinded for thinning. Wafer with devcie patterns are very valuable to customers and they need to be handled with care. Rokko’s process is able to treat wafers without damaging patterns with severely selected protection tapes. Similar to the power device grinding services, a special grinding wheel that stimulates growth of a gettering layer on processing surface is also available.
Rokko’s strength lies in the well-developed sensor device process technologies that enable the company to provide integrated grinding and polishing services.


■ Tools and Equipment
Wafer protection tape applicator

  Fully automated grinding machine

1軸グラインダー
After incoming inspection, pressure sensor or UV tapes are applied on wafers. Taped wafers are inspected of adhered dusts during this process.

1軸グラインダー
Capable of polishing wafers of 4 to 8 inch without influencing flatness characteristics.
Visual inpsection
  Single wafer system polishing machine

1軸グラインダー
Wafer appearance is checked in this process.

1軸グラインダー
Polishes wafers to meet customer’s thickness specification.
Non-contact type processing surface tape remover   Ultrasonic cleaning tool

1軸グラインダー
Remove tapes without contacting processed surface.

1軸グラインダー
Cleans wafers by ultrasonic after removal of tapes.
Heated DIW drying quipment   Final inspection

1軸グラインダー
Dries wafers after cleaning.

1軸グラインダー
Wafers are inspected based on customer’s visual inspection criteia.

Automatic spectral interference wafer thickness meter

分Automatic spectral interference wafer thickness meter
Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).
Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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