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加工技術


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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■  Grinding Technolgy

Grinding and polishing are the core technologies that decide the quality and the characteristics of semiconductors. Rokko is continuously developing its process by adopting new technologies created by consecutive improvements. Because of this effort, Rokko takes a very important role in the fields of MEMS special wafer grinding and polishing processes and its highly established technologies enable the company to fulfill customer’s requests derived from various phases such as R&D or volume productions.

■  Processing Technolgy
研磨技術 Precise grinding is the very important factor for eliminating thickness deviations. In this process, the right type of machine that meets customer’s requirements is carefully selected among the variety of process equipment. Rokko’s grinding technologies are able to guarantee the minimum thickness of 15um in prototyping and 100 to 150um in volume productions.

■  Polishing Technology
ポリッシュ技術 After grinding, small roughness is created on wafer surface. In this process, wafers are carefully polished to remove the roughness. The polishing needs to be done in precise and speedy manners to avoid any distortions and scratches on wafer surface.

■  MEMS Technology
MENS技術 Rokkos’s technologies enable the company to provide integrated grinding and polishing services for MEMS (Micro Electronics Mechanical System) processed wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular.

TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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