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ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan



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▼ Grinding Technolgy

Grinding and polishing are the core technologies that decide the quality and the characteristics of semiconductors. Rokko is continuously developing its process by adopting new technologies created by consecutive improvements. Because of this effort, Rokko takes a very important role in the fields of MEMS special wafer grinding and polishing processes and its highly established technologies enable the company to fulfill customer’s requests derived from various phases such as R&D or volume productions.

■ Processing Technolgy

Processing Technolgy Precise grinding is the very important factor for eliminating thickness deviations. In this process, the right type of machine that meets customer’s requirements is carefully selected among the variety of process equipment. Rokko’s grinding technologies are able to guarantee the minimum thickness of 15um in prototyping and 100 to 150um in volume productions.

■ Polishing Technology
Polishing Technology After grinding, small roughness is created on wafer surface. In this process, wafers are carefully polished to remove the roughness. The polishing needs to be done in precise and speedy manners to avoid any distortions and scratches on wafer surface.

■ MEMS Technology
MEMS Technology Rokkos’s technologies enable the company to provide integrated grinding and polishing services for MEMS (Micro Electronics Mechanical System) processed wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular.

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