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事業案内


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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


New factory opened exclusive
for new material wafer processing

2017/01〜

〜New materials:SiC,Sapphie,LT,etc〜


●Increased processing capacity to cope with mass-production.

●Separated from silicon wafer processing, wafer incoming〜
  delivery to be one-pass process.

●Cost advantage by the process reduction.

●Mass production started in March, 2017.

事業案内 ■ SiC wafer grinding and polishing services
事業案内

Rokko is one of the few companies that provides an integrated SiC wafer processing service (Wafer grinding, polishing and RCA cleaning) through its soley develped technologies.

Rokko has developed techniques to utilize its existing semiconductor tools and equipment for SiC operations. In comparison of the conventional equipment available in the SiC industry, Rokko’s process has its advantages in throughput, wafer warpage, roughness, and flexibility of wafer size.




1軸グラインダー


1軸グラインダー
TREX610

TREX610
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)
candela CS20

candela CS20
Wafer Size: 3, 4, 5, and 6 Inch
Measurable thickness: 300-1400um


SiC wafer process

Comparison of SiC wafer process


  Conventional process Rokko's process
  Diamond lapping Polishing, CMP Grinding Polishing, CMP
Running cost High
(Metal wheels + Diamonds)
Moderate
(Pads + Slurry)
Moderate
(Diamond wheels)
Moderate
(Pads + slurry)
Required level of process technology High Moderate High High
Cost of equipment High Moderate High High
Throughput Very low Low Moderate Moderate
Remarks Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Vacuum chucking system
Utilization of Si process equipment
Fully automated machines
Vacuum chucking system
Utilization of Si process equipment
Single wafer polishing machine
(Self-developed)
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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