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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会


■ Company Aspect

レックス光学の強み

Rokko has the established sophisticate polishing and grinding technique to process front/back surface with high accuracy through its integrated process in order to deliver the finished products to time to meet customer’s needs. This experience allows the company to meet diverse demands of grinding and polishing required by MEMS or other related applications. Rokko always appreciates any inquiries and orders of any size.

■ Processing services
シリコンウエハの加工 ● Integrated grinding and polishing services

Integrated grinding and polishing services
Rokko provides the thin / mirror finished surface required for sensor or power device appreciations through its integrated grinding and polishing process. 4 to 8 inch wafers can be processed with the finished thickness of 15 to 100um in both test and volume productions. Besides the integrated processing services, Rokko is also capable of meeting special processing needs such as grinding-finish (#8000〜) and polishing-only services.
メタルの蒸着加工 ● Monitor wafer reclaiming services

Rokko provides wafer reclaiming services that allow the company to perfectly comply with customer’s specifications of thickness, particles and metal contaminations. 4 to 6 inch wafers are reclaimable in this service.
MEMS加工 ● MEMS Process

Rokko’s experience in this field enables to meet the diverse needs in MEMS applications through its special grinding and polishing technique. This service can be applied from a single wafer production to large volume or prototyping to mass productions. Rokko is well experienced in grinding and polishing SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

■ Process Quality
All services are performed under the clean controlled environment. Rokko is obtained Environment Management System (ISO14000) and Quality Management System (ISO9001) certifications to comply with the international standards/
品質1 ● Pursuit of Quality

Quality is the 1st priority in Rokko’s operations. All parameters are measured and monitored, which includes thickness accuracy, polishing precision to give customers the best available quality and services.
TOPAbout usBusiness InformationCompany AspectProcess TechnologiesQuality・EnviromentTOPICSAccessContact usPrivacy PolicyPower deviceSensor deviceMonitor wafer reclaimMEMS/PrototypeSiCSapphire waferAssuranceQualityEnviromentSafetyPremium processInspection equipmentSapphire & SiC specialized grinderKnife edge prevention processBack graindPolishFor pattern wafer RCA cleaning
六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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