Backside grinding		Backside polishing		Backside grinding & Polishing
	■4-8 inch ■Bumped wafer ■Pressure sensor mounted or UV taped wafer ■Ring-framed wafers		■4-8 inch ■Batch/Single system polishing equipment ■Single/Double side mirror finish ■ＲＣＡ cleaning		■4-8 inch ■Batch/Single system polishing equipment ■Single/Double side mirror finish ■ＧＷＳＳ
	Reclaim polishing		MEMS wafer processing
	■4-6 inch ■Film stripping ■ＲＣＡ cleaning ■Particle・Metal contamination・Thickness・Appearance inspection		■4-8 inch ■BG&POL ■SOI wafer each layer thickness control ■GWSS ■Cavity structured wafer・Through-silicon via wafer ■Half cut dicing wafer

UV irradiator		Fully Automated Grinding machine
Remove the UV tape (Also includes a dicing ring)		Capable of a single wafer and multiple wafer productions.

		Dual steam cleaning tool
		This single tool provides DIW cleaning, rinsing and air drying to wafers up to 8 inch diameter.

Monitor wafer reclaiming
This is recycling services enables monitor wafers used in the semiconductor process to be used again by refining their conditions to the original quality. Through the services, monitor wafers can be used repeatedly to reduce material costs.
Wafer size： ３ inch ４ inch ５ inch ６ inch		Film stripping
		Selected recipe
Incoming inspection				Polishing
Classify thickness and film type
Shipping		Final inspection		Cleaning
		Particle,Metal contamination,Thickness		RCA cleaning

Film stripping		Batch system polishing machine
Various films on wafers are removed by chemical etching.		Performs multiple wafer mirror-polishing.

Single wafer polishing machine		RCA cleaning equipment
A single wafer type polisher		Wafers are cleaned to remove particles and metal contaminations.

●　Integrated grinding and polishing services Integrated grinding and polishing services Rokko provides the thin / mirror finished surface required for sensor or power device appreciations through its integrated grinding and polishing process. 4 to 8 inch wafers can be processed with the finished thickness of 15 to 100um in both test and volume productions. Besides the integrated processing services, Rokko is also capable of meeting special processing needs such as grinding-finish (#8000～) and polishing-only services. ●　Monitor wafer reclaiming services Rokko provides wafer reclaiming services that allow the company to perfectly comply with customer’s specifications of thickness, particles and metal contaminations. 4 to 6 inch wafers are reclaimable in this service. ●　MEMS Process Rokko’s experience in this field enables to meet the diverse needs in MEMS applications through its special grinding and polishing technique. This service can be applied from a single wafer production to large volume or prototyping to mass productions. Rokko is well experienced in grinding and polishing SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

All services are performed under the clean controlled environment. Rokko is obtained Environment Management System (ISO14000) and Quality Management System (ISO9001) certifications to comply with the international standards/ ●　Pursuit of Quality Quality is the 1st priority in Rokko’s operations. All parameters are measured and monitored, which includes thickness accuracy, polishing precision to give customers the best available quality and services.

Rokko is making continuous efforts to develop new technologies in not only Si wafer but also sapphire and SiC process through our cultivated experiences in grinding, polishing and cleaning fields. We believe customer satisfaction is the base of our technology development and our success cannt be achieved without the support from our customers. Based on this standard, we will make further efforts to ensure the satisfaction by introducing cutting edge equipment and technologies.

●　Automatic spectral interference wafer thickness meter Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).

●　Automatic spectral interference wafer thickness meter Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

●　Wafer sorter for resistivity・P/N・thickness For 4,5,6,8 inch

●　Wafer sorter for resistivity・P/N・thickness Measurable resistivity：1.0m～3.0MΩ・cm

Candela CS20 Wafer surface inspection machine		Candela CS20 Wafer surface inspection machine
This is used for transparent substrates to inspect various defects, dirt, pits on Epi layers, hatching and crystal damages.		Wafer Size: 3, 4, 5, and 6 Inch Measurable thickness: 300-1400um

Capacitance wafer thickness measuring equpment TME-07		Capacitance wafer thickness measuring equpment TME-07
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.		Measurable thickness: 100-1800um (depends on wafer sizes) Center point measurement (Coordinates can be set through the machine configuration)

Total reflection x-ray fluorescence analysis tool TREX610		Differential interference contrast microscope
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)		This tool allows to observe roughness on a wafer surface.

Wafer surface laser inspection tool TOPCON WM7		Wafer surface laser inspection tool TOPCON WM3
Detection limit: 7um Unit: Long-life Violet LD laser type Wafer Size: 4, 5 and 6 Inch Ranges：0.087μ～5.0μ		Wafer Size: 4, 5 and 6 Inch Rages：0.208μ～1.0μ

Wafer surface laser inspection tool LS6030		Visual inspection
Wafer Size: 5, 6, 8 Inch Ranges：0.1μ～5.0μ		Wafers are inspected under a halogen lamp in a dark room.

●　Thinned Wafer Diameter：　φ200mm Thickness：　32μm BG：＃2000 Finish

●　GWSS（Glass Wafer Support System） Diameter：　φ200mm Thickness：　11μm BG：＃2000 Finish Glass：　Pyrex

●　GWSS（Glass Wafer Support System） Diameter：　φ200mm Thickness：　4.5μm BG：＃2000 Finish Glass：　Pyrex Backｇgrinding & Polish 8 inch Silicon TV5 (um) Range A B C D E 4.15 4.6 4.37 2.21 3.93 2.39 .

●　Cavity structured wafer Diameter：　φ150mm Thickness：　100μm BG：＃2000 Finish

●　Cavity structured wafer The above wafer was thinned by 5um.

→

Rokko provides pre-grinding beveling services meeting the diversified requirements of finished thickness (ex. 100 um or 50um).

Through the NC control beveling, Rokko is capable of processing wafers with various thickness without changing polishing pads.

Before BG	Beveling	After BG
	※Non-beveling process	※Forming a knife edged shape
	※Beveling process	※Beveling compatible with various wafer thickness to form a proper edge profile

Crick here for the video clip showing a dropping test result of 6 inch wafers “with” and “without beveling” →

●　Knife edge preventing process unit Wafer size: 4, 5, 6, 8 Inch

●　Knife edge preventing process unit Through NC control system, shapes of edge can be adjusted according to its thickness.

●　Backside Grinder Wafer Size: 4, 5, 6, 8 Inch

●　Backside Grinder Achieving higher yields through daily maintenance checks.

Rokko is well experienced in processing various kinds of wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

●　Single wafer backside polishing equipment Wafer Size: 4, 5, 6, 8 Inch

●　Single wafer backside polishing equipment This machine is capable of processing thinned wafers and MEMS wafers.

●　Backside polishing equipment for 8-inch Wafer Size：４・５・６・８inch

●　Backside polishing equipment for 8-inch Best thinning achievement：８inch　８５μm

●　Automatic scrub cleaning process High cleaning performance.

●　Automatic scrub cleaning process Wafer Size：４・５・６・８ inch Sapphire and SiC wafers can be processed

●　Processed surface contactless tape peeling unit Wafer Size: 5, 6 Inch

●　Processed surface contactless tape peeling unit Post-polishing surfaces are very fragile. Micro-scratches can be caused easily if the surface is touched by any metallic equipment parts. This unit is capable of removing tapes without touching wafer surfaces.

Click here for a demonstration of wafer backside RCA cleaning of patterned wafers→

●　RCA cleaning process for patterned wafers Wafer Size: 4, 5, 6, 8 Inch

●　RCA cleaning process for patterned wafers This equipment is capable of cleaning only onside (backside) without causing any damages on the other side.

Fully automated grinding machine		Single wafer system thin film polishing machine
Capable of a single-wafer and multiple-wafer processes.		Polishes wafers with high accuracy without contacting polishing surface. This machine is solely developed and customized by Rokko.

Capacitance wafer thickness measuring equipment		Capacitance wafer thickness measuring equipment
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.		Measurable thickness: 100-1800um (depends on wafer sizes) Center point measurement (Coordinates can be set through the machine configuration)

●　Automatic spectral interference wafer thickness meter Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).

●　Automatic spectral interference wafer thickness meter Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

In a power device, an electric current flows in vertical direction (top to bottom). Because of its characteristics, a power device has electric poles on its backside to have a stream of electric current on front. The backside poles are formed through a metal deposition. In the deposition, a metal layer must grow uniformly or the bonding surface will start to come off (Air penetration causes temperature deviation). Therefore, the process requires a mirror finish rather than a stress relief normal polished surface. To comply with this technical requirement, Rokko is capable of providing mirror polished products that precisely meet customer’s standards through well-developed mirroring technologies.

Rokko has its strength in providing an integrated processing service.

(Grinding → Polishing → RCA cleaning)

Visual inspection		Fully automated grinding machine
Wafers are inspected at receiving, after taping and polishing.		Grinds wafers of 4 to 8” diameter precisely without influencing its flatness.

Single-wafer system polishing machine		Wafer mounting
Wafers are polished according to customer’s thickness requirements.		Wafers are mounted on a ceramic plate.

Batch system polishing machine		Wafer demounting
Polishes 4 to 8” wafers for mirroring.		Wafers are demounted from a plate after polishing.

RCA cleaning		Final inspection
Wafers are cleaned to remove particles and metal contaminations after polishing.		Wafers are measured and inspected to comply with customer’s specifications.

『Customer needs』
● How do you remove stains on patterned or filmed wafer’s surface after thinning / polishing process?
● Do you have any wafers that you cannot input into your process because of the cleaning capability of your equipment?

※In the conventional cleaning process of polished back surfaces, organic or DI wafer based techniques are used to clean particles. In order to remove metal contaminations from the surfaces, it requires RCA cleaning but this method cannot be used because normally RCA cleaning will etches and damages surface of patterns or films.

To meet such customer needs in the semiconductor backend process, Rokko has developed “Rokko Premium Process” through the collaboration with equipment manufacturers.

Conventional process Protective taping Backside grinding Single wafer Backside polishing Processed surface contactless tape peeling

Rokko Premium process Protective taping Knife edge preventive process Backside grinding Single wafer Backside polishing Processed surface contactless tape peeling RCA cleaning process for patterned wafer

→

Rokko provides pre-grinding beveling services meeting the diversified requirements of finished thickness (ex. 100 um or 50um).

Through the NC control beveling, Rokko is capable of processing wafers with various thickness without changing polishing pads.

Before BG	Beveling	After BG
	※Non-beveling process	※Forming a knife edged shape
	※Beveling process	※Beveling compatible with various wafer thickness to form a proper edge profile

Crick here for the video clip showing a dropping test result of 6 inch wafers “with” and “without beveling” →

●　Knife edge preventing process unit Wafer size: 4, 5, 6, 8 Inch

●　Knife edge preventing process unit Through NC control system, shapes of edge can be adjusted according to its thickness.

●　Backside Grinder Wafer Size: 4, 5, 6, 8 Inch

●　Backside Grinder Achieving higher yields through daily maintenance checks.

Rokko is well experienced in processing various kinds of wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

●　Single wafer backside polishing equipment Wafer Size: 4, 5, 6, 8 Inch

●　Single wafer backside polishing equipment This machine is capable of processing thinned wafers and MEMS wafers.

●　Backside polishing equipment for 8-inch Wafer Size：４・５・６・８inch

●　Backside polishing equipment for 8-inch Best thinning achievement：８inch　８５μm

●　Automatic scrub cleaning process High cleaning performance.

●　Automatic scrub cleaning process Wafer Size：４・５・６・８ inch Sapphire and SiC wafers can be processed

●　Processed surface contactless tape peeling unit Wafer Size: 5, 6 Inch

●　Processed surface contactless tape peeling unit Post-polishing surfaces are very fragile. Micro-scratches can be caused easily if the surface is touched by any metallic equipment parts. This unit is capable of removing tapes without touching wafer surfaces.

Click here for a demonstration of wafer backside RCA cleaning of patterned wafers→

●　RCA cleaning process for patterned wafers Wafer Size: 4, 5, 6, 8 Inch

●　RCA cleaning process for patterned wafers This equipment is capable of cleaning only onside (backside) without causing any damages on the other side.

Precise grinding is the very important factor for eliminating thickness deviations. In this process, the right type of machine that meets customer’s requirements is carefully selected among the variety of process equipment. Rokko’s grinding technologies are able to guarantee the minimum thickness of 15um in prototyping and 100 to 150um in volume productions.

After grinding, small roughness is created on wafer surface. In this process, wafers are carefully polished to remove the roughness. The polishing needs to be done in precise and speedy manners to avoid any distortions and scratches on wafer surface.

Rokkos’s technologies enable the company to provide integrated grinding and polishing services for MEMS (Micro Electronics Mechanical System) processed wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular.

Monitor wafer reclaiming
This is recycling services enables monitor wafers used in the semiconductor process to be used again by refining their conditions to the original quality. Through the services, monitor wafers can be used repeatedly to reduce material costs.
Wafer size： ３ inch ４ inch ５ inch ６ inch		Film stripping
		Selected recipe
Incoming inspection				Polishing
Classify thickness and film type
Shipping		Final inspection		Cleaning
		Particle,Metal contamination,Thickness		RCA cleaning

●　Wafer sorter for resistivity・P/N・thickness For 4,5,6,8 inch

●　Wafer sorter for resistivity・P/N・thickness Measurable resistivity：1.0m～3.0MΩ・cm

Film sorting		Film stripping
Wafers are sorted by different types of films by well experienced operators.		Films on wafers are removed by the selected chemicals.

Thickness sorting		Wafer mounting
Wafers are sorted by thickness after film stripping.		Wafers are mounted on a ceramic plate for polishing.

Batch system polishing machine		Wafer demounting
Multiple wafers are polished concurrently.		Wafers are demounted from a ceramic plate after polishing.

RCA cleaning		Particle counter
Wafers are cleaned to remove metal contaminations and particles.		This tool inspects particles on polished wafer surfaces.

Final inspection		Total reflection x-ray fluorescence analysis tool TREX610
Wafers are inspected to comply with customer’s specifications.		Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)

※New factory(D building) overview
		３Ｆ　Cleaning/Outgoing Inspection
		２F Polishing room
		１F Grinding

■ Strength of new factory
		High quality achievement of "Flatness", "Surface roughness", "Work-affected layer" by use of high-rigidity grinder ⇒Reduction of process cost.
		Reduction of sleigh after back-grind thinning. ⇒Capable of one-pass processing of grinding + polishing.
		High level cleanness by introduction of exclusive cleaning equipment for Sapphire （Reduction of contamination + particle）
		Expect to introduce knife-edge prevention process for Sapphire, which is already under operation for silicon.

■ Thinning process of patterned SiC wafer

Example of patterned SiC wafer processing Result of thickness variations of grinded wafer （SiC 6-inch wafer）

Unit：um

※TV5： 1um≧　after grinding

Result of roughness comparison after grinding （SiC 6-inch wafer）
		Thickness variations/surface roughness improved by use of High rigidity grinder..
※Surface roughness improved with conventional grinder.

●　Total reflection x-ray fluorescence analysis tool TREX610 Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)

●　Candela CS20 Wafer surface inspection machine Wafer Size: 3, 4, 5, and 6 Inch Measurable thickness: 300-1400um

●　Automatic scrub cleaning machine High cleaning performance.

●　Automatic scrub cleaning machine Wafer Size：４・５・６・８ inch Sapphire and SiC wafers can be processed

■　 Sapphire wafer post cleaning particle measurement result
150ｍｍ　 Ｓapphire wafer post cleaning particle measurement result
Pre cleaning		Scrb cleaning		RCA cleaning
1.Scrub cleaning is effective for removing large size particle 2Particles and dirt are removed after RCA cleaning 3.10 pieces≧0.3um

■　 Metal contamination after Sapphire wafer cleaning
150ｍｍ　 Ｓapphire wafer metal contamination after wafer cleaning
		ＴＸＲＦ tester
Result of measuring(by TRFX) Sapphire wafer cleaning process ＜5Ｘ1010atoms/ｃｍ2

Wafer protection tape applicator		Fully automated grinding machine
After incoming inspection, pressure sensor or UV tapes are applied on wafers. Taped wafers are inspected of adhered dusts during this process.		Capable of polishing wafers of 4 to 8 inch without influencing flatness characteristics.

Visual inspection		Single wafer system polishing machine
Wafer appearance is checked in this process.		Polishes wafers to meet customer’s thickness specification.

Non-contact type processing surface tape remover		Ultrasonic cleaning tool
Remove tapes without contacting processed surface.		Cleans wafers by ultrasonic after removal of tapes.

		Final inspection
		Wafers are inspected based on customer’s visual inspection criteria.

●　Automatic spectral interference wafer thickness meter Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).

●　Automatic spectral interference wafer thickness meter Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

The below graphs show Rokko’s quality performance.
Rokko focuses on cultivating customer’s trust through the actual process data exhibition of its contracted process services

Back grinding (Processed Qty and Yield)：

↓Click to enlarge image Back grinded products (Thickness based yield) ： ↓Click to enlarge image

Back grinded + Polished products (Processed Qty and Yield)： ↓Click to enlarge image

Back grinded + Polished products (Thickness based yield)： ↓Click to enlarge image

■　

※New factory(D building) overview
		３Ｆ　Cleaning/Outgoing Inspection
		２F Polishing room
		１F Grinding

■ Strength of new factory
		High quality achievement of "Flatness", "Surface roughness", "Work-affected layer" by use of high-rigidity grinder ⇒Reduction of process cost.
		Reduction of sleigh after back-grind thinning. ⇒Capable of one-pass processing of grinding + polishing.
		High level cleanness by introduction of exclusive cleaning equipment for Siapphire （Reduction of contamination + particle）
		Expect to introduce knife-edge prevention process for Sapphire, which is already under operation for silicon.

■ Thinning process of patterned SiC wafer

Example of patterned SiC wafer processing Result of thickness variations of grinded wafer （SiC 6-inch wafer）

Unit：um

※ＴＶ5： 1um≧　after　grinding

Result of roughness comparison after grinding （SiC 6-inch wafer）
		Thickness variations/surface roughness improved by use of High rigidity grinder.
※Surface roughness improved with conventional grinder.

■ Ultra-Thin SiC wafer processing

Sample data of SiC wafers processed with wafer support. 4” SiC wafer used to achieve ultra-thin & ultra-flat. ※Result of thickness variations of grinded wafe　(SiC 4-inch wafer)

Backｇgrinding 4 inch SiC TV5 (um) Range A B C D E 22.88 22.4 22.03 22.75 22.31 0.37

■　SiC wafer grinding and polishing services

Rokko has developed techniques to utilize its existing semiconductor tools and equipment for SiC operations. In comparison of the conventional equipment available in the SiC industry, Rokko’s process has its advantages in throughput, wafer warpage, roughness, and flexibility of wafer size.

●　Total reflection x-ray fluorescence analysis tool TREX610 Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)

●　Candela CS20 Wafer surface inspection machine Wafer Size: 3, 4, 5, and 6 Inch Measurable thickness: 300-1400um

●　Automatic scrub cleaning machine High cleaning performance.

●　Automatic scrub cleaning machine Wafer Size: 4, 5, 6, 8 Inch Sapphire and SiC wafers can be processed

■　 ＳｉＣ wafer grinding process-Roughness
150mm SiC wafer grinding surface roughness

Evaluation		Rough grinding	Final grinding
Roughness	Ｒａ	12.4-14.6nm	2-5nm
Warp	Visual（Scale）	0.5-0.8mm	0.2-0.4mm
※Surface roughness：Non-contact type surface profile measuring equipment :Zygo

■　 ＳｉＣ wafer CMP surface AFM measuring result　 （6 inch）
６ inch SiC surface polishing surface AFM measurement result　 （3 points of surface）
Center Ra:0.711Å		Middle Ra:0.576Å		Edge Ra:0.632Å
150mm SiC wafer Si surface post CMP surface roughness　Ra < 0.1nm

■　 SiC wafer post cleaning particle measurement result
150ｍｍ　 ＳiC wafer post cleaning particle measurement result
Pre cleaning		Scrub cleaning		RCA cleaning
1.Scrub cleaning is effective for emoving large size particle 2Particles and dirt are removed after RCA cleaning 3.10 pieces≧0.3um

■　 Metal contamination after SiC wafer cleaning
150ｍｍ　 ＳiC wafer metal contamination after wafer cleaning
		ＴＸＲＦ tester
Result of measuring(by TRFX) SiC wafer cleaning process ＜5Ｘ1010atoms/ｃｍ2

●　Diamond lapping equipment For 3,4,5,6 inch.

●　Diamond lapping equipment Film stripping for ＳｉＣ wafer reclaim.

Specialized Grinder for Sapphire and SiC		Specialized Grinder for Sapphire and SiC
This equipment is made for 6 inch hard-substrate wafers such as sapphire and SiC.		Automated process via NC control system

Specialized Grinder for Sapphire and SiC		Specialized Grinder for Sapphire and SiC
This machine is equipped with an automated wafer conveyance system to perform fully automated wafer processing.		Equipped with a vacuum checking system (Wax-less)

6 inch Sapphire wafer		6 inch Sapphire wafer
Both patterned and prime wafers can be processed.		SiC wafers are processed by the special grinding wheel.

6 inch SiC wafe		6 inch SiC wafe
Both patterned and prime wafers can be processed.		SiC wafers are processed by the special grinding wheel.

First of all, I would like to express my gratitude to all those who have been supporting us over the past years. Our roots began in 1921 when the founder, Katsujiro Kobayashi started research on flat polishing technologies at a Japanese naval arsenal. Later, Kobayashi established a company that manufactures special optical measurement units, “Rex Optical Research Center”. In the year of 1963, known as the year of the birth of the Japanese semiconductor industry, the company was renamed to “Rex Optical Measurement Unit Manufacturing Company” and started polishing and processing services in the semiconductor industry. In 1983 when the office was moved to Fukuoka, a new company “Rokko Denshi” was established to take over the semiconductor operations from “Rex”. Because of the recent movement that semiconductor technologies are widely spread in our daily lives and become a driving force that accelerates development of the information technology, Rokko decided to focus on silicon wafer processing operations which includes prime wafer mirroring, double side polishing and backside grinding services. Additionally, wafer reclaiming operations are launched in 1994. Rokko expanded the business by adopting the state of the art equipment such as large scale polishers, grinders, lappers and the variety of measurement tools in order to supply the combined services of grinding, polishing and etching required for the silicon material process. After all these years, Rokko’s effort is still set on the company’s policy of “Making better products faster, cheaper, and safer” and the company will continue to improve its quality of services and technologies through creativity and innovativeness to become a better company that is trusted, expected by the society. Every Rokko’s employees will continue to strive to achieve this goal.

- To provide a thoughtful service that exceeds customer’s expectations.

- To grow and improve through customer satisfaction and open up a new market to find new customers.

- Through the above success, to seek greater happiness for all employees and their families.

Name	Rokko electronics Co., Ltd.
Location	Zipp:663-8105　8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan
TEL FAX	81-798-65-4508 81-798-67-5038
Establishment	September, 1983
Capital	USD375,000
Board	President　Hidemori Kobayashi
Related Company	Rex Optical Meter works Ltd.
Business	Silicon wafer processing Reclaiming Polishing Grinding MEMS compatible super thinning polishing special processing Etching

March, 1921	The founder, Katsujiro Kobayashi started research on flat polishing technologies with German engineers at a Japanese naval arsenal. Later, he moved to the company “Japanese Optical Industries” (Former Nikon) and worked in the polishing field.
July, 1932	Established “Kobayashi Optical” in Tokyo. Started sales activities for optical measuring units and special processing services.
March, 1947	After WWII, the company was moved to Nishimiyashi, Hyogoken and renamed to “Rex Optical Research Center” as a special optical measurement unit manufacturer.
April. 1960	Started semiconductor polishing services.
June. 1963	Reorganized and renamed “Rex Optical Measurement Unit Manufacturing Company”. Focused on wafer polishing business.
September. 1983	Rokko Denshi was established to take over the semiconductor operations. Rex was relocated in the site of Mitsubishi Electric (Fukuoka).
July. 1994	Fab B was built to develop reclaim wafer operations. Large scale polishers and RCA cleaning equipment were installed.
May. 2001	Obtained ISO 14001 certification
February. 2005	MEMS compatible thin wafer polisher was installed.
March. 2005	Obtained ISO 9001-2000 certification
November, 2012	Awarded as the outstanding performance company,by Nishinomiya-city
January, 2017	Mr. Hidemori Kobayashi appointed as President
January, 2017	New factory started operation for new material wafers: SiC, Sapphire, LT, etc.
February. 2018	Obtained ISO 9001-2015 and 14001-2015 certification

There are always risks of accidents or disasters in a manufacturing plant. Rokko realizes its responsibility to ensure safety of employees not only during work hours but also time of commuting. To fulfill such responsibility, the company organizes a safety and health committee and holds a meeting on a monthly basis. In this meeting, safety issues brought up by the divisions of the company are reviewed to make a “risk assessment chart”. Safety issues are prioritized in the chart to take measures and monitor its progress by “PDCA” techniques. Also periodically, safety and health supervisors patrol the factory to check its working environment for continuous improvements.

In September, 2011, Rokko published the business continuity plans to comply with the guidelines of the Small and Medium Enterprises Agency’s “BCP (Business Continuity Plan)” and reviews and updates the continuity plans through safety and health committee meetings.

Safety and Health Committee		Risk Assessment
A meeting is held on a monthly basis to review safety and health related issues.		Potential risks in the company are reviewed and prioritized to take measures.

In process patrols		Continuous process safety improvements
Supervisors patrol to assess potential risks in process.		Observations found through process patrols are listed for continuous improvements and measures.

Certified employees		BCP
Safety management supervisor : 2 persons Class 1 health supervisor:4 persons		In September, 2011, Rokko published the business continuity plans to comply the guidelines of the Small and Medium Enterprises Agency’s “BCP (Business Continuity Plan)”.

Emergency contact networks		Emergency contact networks
Emergency communication flows are clearly visualized for its employees in case of emergency.		In all processes, emergency contact networks are posted.

Evacuation routes		Eye washers
Evacuation routes are visually available for all employees and drills are conducted according to the routes.		It is a mandatory to wear an eye covering during operation. In case of eye injury, eye washers are installed in process.

Medical networks		Emergency calls
Hospitals are listed in case of emergency.		“How to make emergency calls” is posted to help a person to make an emergency call in a proper manner.

Electric power failure evacuation drills		Electric power failure evacuation drills
Drills are carried out periodically to train its employees and ensure quick evacuation in case of emergency.		Firstly, operators take shut down sequence of process equipment and secondary, a group leader escort operators for evacuation.

Electric power failure evacuation drills		Electric power failure evacuation drills
All stuff and operators are evacuated to the company’s parking lot.		Rokko achieved the evacuation time of 7min 46sec against the initial target of 10min.

Rokko thinks good quality is accomplished through continuous efforts to produce finished products that give customers greater satisfaction and supply its products without delay. Rokko has never forgotten that some of the products that the company processes may become a part of devices that support human lives. So employees of the company perform assigned duties with honors and prides and Rokko will continue to strive for a better quality of services.

ISO9001：2015 Certification		Standard operation procedures
Rokko obtained ISO9001 certification in March of 2005. The company implemented the ISO recommended tool, “PDCA” (plan, do, check, and action) to achieve the company’s various objectives.		Rokko has worked on maturing its SOP to synchronize its operator’s work performance.

Process Flow		Certified skill tables
A process flow chart is visually available in processes for operators to minimize human errors.		By summarizing certified skills of every operator in a table format, the table helps operators visualize next target skills.

Daily process check books		Measurement tool check sheets
Machine startup checklists are prepared for equipment activations.		Calibrations of every tool are recorded.

Machine based operating cycle time books		In process cleaning check sheets
All machines are maintained based on cycles of operation.		In-process and machinery cleaning activities are recorded consistently.

PH check tables		Small group activity meeting minutes
PH calibration of polishing machines is recorded.		Periodical group meetings are held by process operators and meeting minutes are filed.

Filing list		Temperature and humidity recording
All records are filed properly.		Temperature and humidity are measured and recorded.

Quality management meeting 1		Quality management meeting 2
A quality management meeting is held on a monthly basis.		This meeting is voluntary held based on customer’s needs and requirements.

Rokko Electronics Co., Ltd. is located at the Nishinomiya city’s semi-industrial district, Nakashima-cho. Rokko has an important role in the semiconductor material processing services. However, on the other hand, the operations consume a large amount of energy, natural resources and chemical substances which results in generating industrial wastes. Realizing these facts, all of Rokko employees will voluntary participate in the environmental activities to sustain the eco-friendly society.

2011　Article, Ninomiya-City’ Environmental Report： Ninomiya-city introduced the Rokko’s “Green curtains” in the city’s published environmental report.

ISO14001 certification		Qualified personnel list
Certified for ISO14001 in May, 2001.		11 persons attended the ISO14001 internal auditor certification seminar.

Nshinomiya city district promotion center for prevention of global warming		Demand supervisory control unit
Rokko is selected for “Nishinomiya city district promotion center for prevention of global warming”.		As per the request of summertime electricity saving from Kansai Electric, Rokko installed the equipment to monitor its electricity usage.

The Green Curtains		The Green Curtains
Cooperating in the electricity saving, Rokko applied the green curtains to its building.		The "Green Curtain" serves as a covering of windows by climbing plants such as bitter gourd. It not only prevents room and outside surface temperatures of buildings from rising by blocking the strong summer sunshine, but also helps to cool down room temperature via foliage transpiration.

Bitter gourds		Bitter gourds
Over 500 pcs of bitter gourds are harvested.		The harvested bitter gourds are shared among its employees and the neighbors

Certified industrial waste storage area
Supervisors are assigned to manage conditions and locations of stored industrial wastes.

The Rokko’s quality policy is to make wide contributions to the society through its business prosperity. In order to achieve this goal, all of the company’s operations must serve the society’s welfare and Rokko believes that “Quality・Price・Delivery・Service” are the essences of such contributions and the company will make the best possible effort to pursue all the essences . Especially, as the manufacturer, Rokko puts its highest priority on its quality to provide the products and the services that satisfy customers. Through the products and the services, Rokko will achieve its prosperity and contributions to the society concurrently. Under this policy, all the Rokko employees put their hearts in “Customer’s satisfaction first”

Rokko’s business operations cover the wide range of semiconductor materials while the semiconductors are closely related to variety of areas of our daily. The company is making a great contribution to our society through the silicon reclaim wafer operations which are the recycling services of used semiconductor materials. However, on the other hand, the operations consume a large amount of energy, natural resources and chemical substances which results in generating industrial wastes. Realizing these facts, all of Rokko employees will voluntary participate in the environmental activities to sustain the eco-friendly society.

1.Basic Policy ： ・Basic policy for BCP 2.BCP operational structure: ： ・Development of BCP and its operational structure 3.Core businesses and recovery target: information on core businesses ・Information on alternative source for various resources critical to business continuity 4.Financial diagnoses and planning of contingency measures ： ・Calculation of recovery costs and cash on hand ・Investment planning for contingency measures (refer to Regional Hazard Map) 5.Invoking BCP in response to emergency (1)Invocation flow (2)Evacuation: evacuation planning sheet (3)Information sharing: contact information of main organizations [financial institutions] ・List of contact information of employees ・[Basic information sharing] → refer to the list of all employees ・chain of communication in emergency ・Telephone number/FAX number sheet [internal use] 】 ・Information related to main customers →Refer to status list by business connection (4)Resources ・Bottleneck resources for core businesses ・[Facilities/equipment/vehicles etc.] → refer to the Fixed Asset Ledger ・Information on supplies critical to core businesses ・Information related to main suppliers/vendors [by supplied item] →refer to the Purchase Ledger ・Check list on disaster tools

The purpose of BCP (business continuity plans) and key points for securing business continuity in emergency at Rokko are as follows: 1. Purpose of BCP development and operation: ： ①For our customers To minimize impacts on our customers’ production plans. ②For our employees To protect safety and employment for our employees including their families. ③For regional community To contribute to community life and economy. ④Others 2. Key points for securing business continuity in emergency: ： ①Rokko will cooperate with neighboring companies in the region to overcome difficulties. Rokko will cooperate with neighboring companies in the region to overcome difficulties. ②Conscientious business practice We will make payments due to our suppliers without delay even in emergency. ③Contribution to the community We will help each other in the community in emergency by, for example, serving hot meals to disaster victims. ④Utilization of public emergency relief system In emergency, we will make use of the emergency consultation service at the city hall and chamber of commerce. ⑤Others 3. Renewal period for BCP and Emergency Plan: every September (annual update)

Development of BCP basic policy Normal times Implementation of BCP cycle Update based on newly experienced issues and lessons ①Understanding of the company’s business       ⑤Testing, maintenance and update of BCP   ②Discussion on how to prepare BCP and contingency measure   ④Establish BCP culture ③Creation of BCP Occurrence of an emergency situation Recovery from emergency Invocation of BCP

Based on our mission statement, “To provide a thoughtful service that exceeds customer’s expectations; to grow and improve through customer satisfaction and open up a new market to find new customers; through the above success, to seek greater happiness for all employees and their families,” we will pursue provision of a thoughtful service not only for customer but also for employees, regional community, and society. In doing so, we will seek to grow and improve. This is the philosophy that lies at the heart of our CSR activities.

1. Compliance 1）Compliance with the laws and regulations 2）Fair competition and trade 3）Prevention of conflict of interests 4）Prohibition of bribery, excessive entertainment, and gifts 5）Prevention of leakage of information (information security) 6）Security export control 2. Respect for human rights 3. Healthy work environment 1）Safe work environment 2）Health considerations 3）Facilitation of employee-friendly work environment 4. Relationship with society 1）Customer satisfaction 2）Contribution to society 3）Protection of environment 4）Firm stand against anti-social individuals and groups

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