Rokko takes the following roles in the semiconductor production
process.
- Wafer surface and backside sophisticate grinding and polishing
- Monitor wafer reclaiming
- Chemical processing and RCA cleaning to control metal contaminations
and particles in reclaim wafer process.
- Special wafer processing for MEMS applications
■ Main process services
Backside grinding
Backside polishing
Backside grinding & Polishing
■4-8 inch
■Bumped wafer
■Pressure sensor mounted or UV taped wafer
■Ring-framed wafers
■4-8 inch
■Batch/Single system polishing equipment
■Single/Double side mirror finish
■ＲＣＡ cleaning
■4-8 inch
■Batch/Single system polishing equipment
■Single/Double side mirror finish
■ＧＷＳＳ
Reclaim polishing
MEMS wafer processing
■4-6 inch
■Film stripping
■ＲＣＡ cleaning
■Particle・Metal contamination・Thickness・Appearance inspection
■4-8 inch
■BG&POL
■SOI wafer each layer thickness control
■GWSS
■Cavity structured wafer・Through-silicon via wafer
■Half cut dicing wafer
■ Introduction and description of the used equipment in each
process
UV irradiator
Fully Automated Grinding
machine
Remove the UV tape (Also includes a dicing ring)
Capable of a single wafer and multiple wafer productions.
Dual steam cleaning tool
This single tool provides DIW cleaning, rinsing and air drying
to wafers up to 8 inch diameter.
Monitor wafer reclaiming
This is recycling services
enables monitor wafers used in the semiconductor process to
be used again by refining their conditions to the original
quality.
Through the services, monitor wafers can be used repeatedly
to reduce material costs.
Wafer size：
３ inch
４ inch
５ inch
６ inch
Film
stripping
Selected recipe
Incoming
inspection
Polishing
Classify thickness and film type
Shipping
Final
inspection
Cleaning
Particle,Metal contamination,Thickness
RCA cleaning
Film stripping
Batch system polishing
machine
Various films on wafers are removed by chemical etching.
Performs multiple wafer mirror-polishing.
Single wafer polishing
machine
RCA cleaning equipment
A single wafer type polisher
Wafers are cleaned to remove particles and metal contaminations.
