Rokko is making continuous efforts to develop new technologies in not only Si wafer but also sapphire and SiC process through our cultivated experiences in grinding, polishing and cleaning fields. We believe customer satisfaction is the base of our technology development and our success cannt be achieved without the support from our customers. Based on this standard, we will make further efforts to ensure the satisfaction by introducing cutting edge equipment and technologies.

●　Automatic spectral interference wafer thickness meter Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).

●　Automatic spectral interference wafer thickness meter Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

●　Wafer sorter for resistivity・P/N・thickness For 4,5,6,8 inch

●　Wafer sorter for resistivity・P/N・thickness Measurable resistivity：1.0m～3.0MΩ・cm

Candela CS20 Wafer surface inspection machine		Candela CS20 Wafer surface inspection machine
This is used for transparent substrates to inspect various defects, dirt, pits on Epi layers, hatching and crystal damages.		Wafer Size: 3, 4, 5, and 6 Inch Measurable thickness: 300-1400um

Capacitance wafer thickness measuring equpment TME-07		Capacitance wafer thickness measuring equpment TME-07
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.		Measurable thickness: 100-1800um (depends on wafer sizes) Center point measurement (Coordinates can be set through the machine configuration)

Total reflection x-ray fluorescence analysis tool TREX610		Differential interference contrast microscope
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)		This tool allows to observe roughness on a wafer surface.

Wafer surface laser inspection tool TOPCON WM7		Wafer surface laser inspection tool TOPCON WM3
Detection limit: 7um Unit: Long-life Violet LD laser type Wafer Size: 4, 5 and 6 Inch Ranges：0.087μ～5.0μ		Wafer Size: 4, 5 and 6 Inch Rages：0.208μ～1.0μ

Wafer surface laser inspection tool LS6030		Visual inspection
Wafer Size: 5, 6, 8 Inch Ranges：0.1μ～5.0μ		Wafers are inspected under a halogen lamp in a dark room.