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Please contact ROKKO at
Attention Mr.:EGAWA/
Overseas Sales Dept.

TEL: 81-798-65-4508
FAX: 81-798-67-5038

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for pattern wafer RCA cleaning


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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan





SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会

■ Topics
  2012/09/05-07

Participated in Semicon Taiwan 2012 to introduce the newly developed SiC/sapphire wafer polishing technologies.

       
  August 11th, 2011

●The Rokko’s “Green Curtains”, the bitter gourds were planted in the middle of May. They have grown very well and reach the third floor of the building. The green curtain is an energy saving tool that not only prevents room and outside surface temperatures of buildings from rising by blocking the strong summer sunshine, but also helps to cool down room temperature via foliage transpiration. As the eco-friendly organization, Rokko gives full cooperation in energy saving through the green curtains and the demand supervitory control unit.



  July 30th, 2011




July 30th (Sat) 16:00

Power failure evacuation drill was carried out. After shutting down processing equipment and tools, group leaders escorted operators to the company’s parking lot for evacuation. In this drill, Rokko achieved 7 min 46 sec of evacuation time against the target of 10 min.

  July 25th, 2011

Exhibited at “Micro-machine / MEMS Show 2011”, Tokyo Big Sight

Exhibited items

SiC wafer, 3 inch as grinded・polished

Sapphire wafer, 4 inch as grinded・polished

Soi Wafer polishing

Glass support wafer grinding

Glass support wafer polishing

Cavity structured wafer grinding

Cavity structured wafer polishing

Through-holed wafer grinding

Non-circular wafer grinding

Reclaim wafer

Grinded + Polished wafer

#8000 grinding finished wafer

  July 7th, 2011
Exhibited at SIIQ Semiconductor Festival & Kyushu broadcasting Equipment Exhibition for the first time.

SIIQ Semiconductor Festival

  May 31st, 2011
Announced “MEMS wafer special grinding・polishing & SiC・GaN・Sapphire substrate” at “SEMI FORUM JAPAN 2011” (SFJ technology introduction seminar that introduced new technologies, newly developed equipment and tools)

SFJ Technology Introduction Seminar

  March 16th, 2011
“19th DCP Business Forum” was held at Osaka Chamber of Commerce and Industry. Rokko introduced its business plans including the following.

“MEMS wafer special grinding・polishing & SiC・GaN・Sapphire substrate”

“DCP Business・Forum”

  December 1st, 2010

Exhibited at “Semicon・Japan2010”, Makuhari Messe for the first time.

Exhibited items

SiC wafer, 3 inch as grinded・polished

Sapphire wafer, 4 inch as grinded・polished

Soi Wafer polishing

Glass support wafer grinding

Glass support wafer polishing

Cavity structured wafer grinding

Cavity structured wafer polishing

Through-holed wafer grinding

Non-circular wafer grinding

Reclaim wafer

Grinded + Polished wafer

#8000 grinding finished wafer




November 1st, 2010
Personnel Changes

At the stockholder’s meeting held on October 29th, the following changes became effective from November 1st were announced.
1. Kaoru Matsunaka

Director / general manager of production → Resigned

2. Hidemori Kobayashi

Director of Corporate General affair・Sales → Director / Vice president

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六甲電子株式会社
兵庫県西宮市中島町8番5号 TEL : 0798-65-4508
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